GP2W1001YP0F
MAX 60s
MAX 5s
MAX 160s
MAX 115s
40s to 90s
1. In case of solder reflow
Please carry out only one time soldering at the temperature and the time within the temperature profile as shown
in the figure below.
2. Other precautions
3. Soldering
?SPAN class="pst GP2W1001YP0F_2589539_0">Soldering Method
1 to 3/s
1 to 3/s
1 to 5/s
An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin.
So keep the package temperature within that specified in Item 1. Also avoid immersing the resin part in the solder.
Even if within the temperature profile above, there is the possibility that the gold wire in package is broken
in case that the deformation of PCB gives the affection to lead pins. Please use after confirming the conditions fully
by actual solder reflow machine.
鸖oldering iron shall be less than 25W, and temperature of point of soldering iron shall use at 260or less.
鸖oldering time shall be within 5s.
鸖oldered product shall treat at normal temperature.
225
MAX
195
25
MAX
245
Sheet No.: E3-A00101EN
10
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